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AMD has made over $10b in investments to its strategic partners across Taiwan as it's inches away from deploying 6th Gen EPYC & MI450X inside its Helios AI racks.
AMD invested over $10 billion in the Taiwan ecosystem to expand advanced packaging for AI infrastructure.
KEY POINTS
- The Helios AI rack will debut with 6th Gen EPYC 'Venice' CPUs and Instinct MI450X GPUs in 2H 2026.
- AMD qualified the industry's first 2.5D panel-based EFB interconnect with PTI, enabling scalable high-bandwidth AI systems.
- The new EFB-based 2.5D packaging raises interconnect bandwidth and efficiency for the Venice CPU generation.
COMPANIES
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