semiconductor / news / / CNBC
Almost all of the chipmaking step, known as advanced packaging, happens in Asia.
TSMC currently sends 100% of its chips to Taiwan for advanced packaging, even those made in Arizona.
KEY POINTS
- Nvidia has reserved most of TSMC's latest CoWoS-L packaging capacity, creating a supply bottleneck.
- Intel's advanced packaging customers include Amazon, Cisco, and now Elon Musk's SpaceX, xAI, and Tesla.
- TSMC and Intel are developing 3D packaging methods, with TSMC's SoIC products expected in a few years.
- Hybrid bonding, replacing bumps with copper pads, is emerging to improve chip stacking and performance.
COMPANIES
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