semiconductor / news / / MarketScreener
Taiwanese chip designer MediaTek says it supports both TSMC's and Intel's advanced packaging technologies.
MediaTek supports both TSMC's CoWoS and Intel's EMIB advanced packaging technologies for custom silicon.
KEY POINTS
- Intel's EMIB packaging is being considered for custom AI chips MediaTek is designing for Google.
- MediaTek doubled its 2026 data center revenue forecast to $2 billion, indicating rapid business expansion.
- MediaTek has multiple test chips on TSMC's upcoming A14 process, expected for production in 2028.
- MediaTek plans to use TSMC's Arizona fabs for 4nm and 3nm chip manufacturing.
COMPANIES
Summarized by Newsio from MarketScreener. How we summarize →