semiconductor / news / / Wccftech
OpenAI has published a new patent in which it discloses an AI chip housing several compute chiplets, surrounded by a large number of HBM memory stacks.
OpenAI's new patent details AI chips with multiple compute and HBM chiplets connected by Embedded Logic Bridges.
KEY POINTS
- These Embedded Logic Bridges extend HBM-to-compute distances from 6mm to 16mm, surpassing JEDEC standards.
- OpenAI's design enables up to 20 HBM memory stacks per compute chiplet, greatly exceeding current memory stack limits.
- The proposed solution is compatible with UCIe standards and parallels Intel's EMIB technology for advanced chip packaging.
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