semiconductor / news / / The Economic Times
Australian firm Syenta secured twenty-six million dollars for a new AI chip manufacturing method.
Syenta developed a chip packaging method that reduces copper wiring steps by 40 percent.
KEY POINTS
- The new process uses electrochemical transfer, enabling faster production of chip base layers.
- Syenta will open a new office in Arizona and former Intel CEO Pat Gelsinger joins its board.
- The company targets high-volume manufacturing of AI chip base layers by 2028.
COMPANIES
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