semiconductor / news / / Wccftech
Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years.
Amkor claims glass substrate packaging will be commercially ready within three years.
KEY POINTS
- Glass substrates offer superior thermal stability and deformation suppression compared to organic substrates.
- Intel and Amkor are collaborating on glass substrate technology for next-generation AI chip packaging.
- Earlier doubts about glass substrates' stress resistance are being resolved, according to Amkor's team leader.
COMPANIES
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