# 這項估計約為33億美元的雄心計畫，是印度最重要的高科技製造投資之一。

*semiconductor · news · 2026-05-29 · Devdiscourse*

## Key points

- 奧里薩邦與英特爾及3DGS公司簽署諒解備忘錄，建設封裝玻璃核心基板工廠。
- 位於布巴內斯瓦爾的該設施估計耗資約33億美元。
- 英特爾將為這座先進製造設施提供關鍵技術專長。
- 該計畫預計在第一階段創造超過1,800個專業職位。

India's drive to enhance its semiconductor production capacity received a substantial boost as Odisha inked an agreement with Intel Corporation and 3DGS Inc. of the USA. This landmark initiative involves establishing an advanced packaging glass core substrate production facility in Bhubaneswar. The ambitious project, estimated at around USD 3.3 billion, stands as one of the most significant high-tech manufacturing investments in India. Union Minister of Electronics and IT Ashwini Vaishnaw emphasized the significance of this undertaking. 'This MoU will propel India's semiconductor ecosystem forward,' Vaishnaw stated in a recent social media update. Located in Info Valley, the facility aims to generate over 1,800 specialized jobs and countless indirect opportunities in the wider tech and manufacturing sectors. The project will unfold in multiple phases over five to six years with crucial tech expertise and knowledge from Intel. (With inputs from agencies.)

**Companies:** Intel Corporation, 3DGS Inc.
**Countries:** India, USA

[Read the full story on Devdiscourse](https://www.devdiscourse.com/article/business/3925987-odisha-partners-with-intel-and-3dgs-to-boost-semiconductor-manufacturing)

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