# 一項33億美元的重要投資將推動印度半導體生態系統。

*semiconductor · news · 2026-05-29 · The Economic Times*

## Key points

- 英特爾、奧里薩與3DGS投資33億美元，在布巴內斯瓦-庫爾達建立先進封裝設施。
- 該設施將專注於玻璃核心基板及高密度互連基板，用於先進半導體。
- 英特爾承諾提供重要的技術轉移與製程專業知識，以支持設施運營。
- 截至目前，此項投資尚未正式納入印度半導體任務計畫。
- HIPSPL在奧里薩的工廠由英特爾與洛克希德馬丁持股，已於四月動工。

Synopsis A significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions have signed a memorandum of understanding. This collaboration will establish a new facility in Bhubaneswar-Khurda, focusing on advanced packaging and glass core substrates. New Delhi: Chip giant Intel, Odisha government and US-based 3D Glass Solutions (3DGS) signed a memorandum of understanding to expand substrate manufacturing technology in India with an investment of $3.3 billion, one of the highest in hi-tech manufacturing in India. Electronics and information technology minister Ashwini Vaishnaw said the investment will further advance the semiconductor ecosystem in India. Odisha chief minister Mohan Charan Majhi and Intel CEO Lip-Bu Tan also participated in Friday's signing. To be located in Bhubaneswar-Khurda region, the proposed facility will be set up in phases over five-six years and is expected to generate more than 1,800 direct high-skilled jobs. Also read | Rising prices may hit 54 pc of festive smartphone demand, denting annual sales by up to 30 pc It will focus on advanced packaging of glass core substrates, high-density interconnect substrates (HDI) and associated semiconductor technologies. While substrates connect microchips to motherboards, these advanced foundations allow for more computing power and prevent warping. Glass core substrates are increasingly sought after as semiconductors use heavy, multi-chip architectures like AI processors while HDI substrates allow complex chips to communicate with shorter electrical paths. Live Events Officials pointed to significant knowledge transfer committed by Intel, which will support the facility with technology know-how and process expertise. The investment is also expected to help develop a local supplier ecosystem and ancillary industries and export-oriented manufacturing. Creation of skilled employment and technical workforce development in Odisha is also a target. Officials said the project will dovetail with 3DGS and Intel's existing presence in Odisha. Heterogeneous Integrated Packaging Solutions Pvt Ltd (HIPSPL), a subsidiary of high-tech manufacturing firm 3DGS, is setting up a vertically integrated advanced packaging and embedded glass substrate unit at a cost of ₹1,943 crore. Ground-breaking for the HIPSPL plant took place in April. It has a 11-13% equity investment each from Intel, aerospace and defence contractor Lockheed Martin and Applied Materials, as well as venture capital funds. India's first compound semiconductor fabrication unit is also being established in Odisha. Also read | India needs to build $120-$150 billion semiconductor value chain: NITI Aayog Friday's announcement is not classified as an official approved project under the India Semiconductor Mission as of now, an official said. Potential inclusion of the investment under mission will have to be deliberated once the government announces ISM 2.0, he added. (You can now subscribe to our Economic Times WhatsApp channel) (Catch all the Business News, Breaking News and Latest News Updates on The Economic Times.) Subscribe to The Economic Times Prime and read the ET ePaper online. ...moreless (You can now subscribe to our Economic Times WhatsApp channel) (Catch all the Business News, Breaking News and Latest News Updates on The Economic Times.) Subscribe to The Economic Times Prime and read the ET ePaper online. ...moreless

**Companies:** Intel, 3D Glass Solutions
**Countries:** India, United States

[Read the full story on The Economic Times](https://economictimes.indiatimes.com/industry/cons-products/electronics/intel-3dgs-sign-3-3-billion-odisha-semiconductor-mou/articleshow/131397267.cms)

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