# 美國晶片製造商英特爾與3DGS Inc. USA將投資33億美元設立基板製造廠，預計創造超過1,800個直接高技能工作機會。

*semiconductor · news · 2026-05-29 · The Star*

## Key points

- 英特爾與3DGS Inc. USA將在印度奧里薩邦共同投資33億美元。
- 奧里薩工廠將專注於先進封裝玻璃核心基板及高密度互連基板。
- 該設施預計在當地創造超過1,800個直接高技能工作機會。
- 工廠將在布巴內斯瓦-庫爾達地區建設，預計耗時五到六年。

NEW DELHI, ⁠May 29 (Reuters) - U.S. chipmaker Intel ⁠and 3DGS Inc. USA will invest ‌about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state ​of Odisha, the Indian ⁠government said on ⁠Friday. Here are some details: • The project ⁠is ‌expected to create more than 1,800 direct high-skilled jobs. • ⁠Substrates are the bedrock material on ​which ‌elements of a semiconductor device are ⁠attached. • ​New Delhi has pledged billions of dollars in subsidies to attract semiconductor ⁠plants and related manufacturing ​as a part of Prime Minister Narendra Modi's wider push to build ⁠more products locally. • The plant, planned to be set up in the Bhubaneswar-Khurda region over a period ​of five to six ⁠years, will focus on advanced packaging ​glass core substrates, ‌high-density interconnect substrates and ​associated semiconductor technologies. (Reporting by Hritam Mukherjee; Editing by Eileen Soreng)

**Companies:** Intel, 3DGS Inc. USA
**Countries:** United States, India

[Read the full story on The Star](https://www.thestar.com.my/tech/tech-news/2026/05/29/intel-3dgs-to-set-up-33-billion-substrate-plant-in-india039s-odisha-state)

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