# 英特爾與3DGS攜手將半導體基板製造技術引入印度。

*semiconductor · news · 2026-05-29 · Devdiscourse*

## Key points

- 英特爾、奧里薩政府及3DGS將在印度引入半導體基板製造技術。
- 此次合作計畫涉及約33億美元的投資。
- 布巴內斯瓦-庫爾達地區被選為先進封裝創新項目的地點。
- 此計畫預計將創造超過1,800個直接高技能職位。

Intel Corporation has joined forces with the Odisha government and 3DGS to introduce semiconductor substrate manufacturing technology to India. This collaboration highlights a substantial step towards strengthening the nation's semiconductor capabilities. The memorandum of understanding was signed with participation from electronics and IT minister Ashwini Vaishnaw and Odisha's chief minister, Mohan Charan Majhi. The agreement signals a significant investment in India's high-tech sector, with an estimated budget of USD 3.3 billion. The initiative aims to create over 1,800 direct high-skilled jobs and substantial indirect employment. Set in the Bhubaneswar-Khurda region, the project will ultimately enhance India's technological landscape, focusing on innovations in advanced packaging and high-density interconnect substrates. Apart from operational progress, the agreement marks a milestone with India's India Semicon Mission 2.0, reflecting the global industry's trust in India. (With inputs from agencies.)

**Companies:** Intel Corporation
**Countries:** India

[Read the full story on Devdiscourse](https://www.devdiscourse.com/article/technology/3926060-intel-collaborates-with-odisha-for-advanced-substrate-manufacturing-in-india)

---

Canonical: https://newsio.io/zh-TW/n/960fe6f7-689c-4274-ba89-aad329922a8b/3dgs1800
Summarized by Newsio from Devdiscourse. https://newsio.io/how-it-works