# 北京大學研究人員宣稱在微晶片設計軟體上取得突破，該軟體為華為技術提供關鍵支持，助其在美國主導的貿易限制下打造尖端半導體。

*semiconductor · news · 2026-05-27 · South China Morning Post*

## Key points

- 北京大學展示了與華為LogicFolding架構相容的EDA工具原型。
- 這款國產EDA工具直接支持華為2031年前生產1.4奈米級晶片的嘗試。
- 華為新的Tau Scaling Law優先提升內部布線效率，而非進一步縮小電晶體尺寸。
- 該大學EDA突破降低了對受美國出口禁令限制的西方軟體的依賴。

Researchers at Peking University have claimed a breakthrough in microchip design software, purportedly offering critical support to Huawei Technologies as the tech giant attempts to build cutting-edge semiconductors despite US-led trade restrictions. The innovation, unveiled on Tuesday, comes in the form of a prototype tool for electronic design automation (EDA), according to an announcement by the university’s School of Integrated Circuits. EDA is the highly specialised software that engineers use to design and test microchips before they are manufactured. Developing a domestic alternative has become a top priority for Beijing because the global EDA market is dominated by Western players such as Synopsys and Cadence Design Systems. The university’s new EDA tool is compatible with Huawei’s LogicFolding architecture introduced on Monday. The company’s goal is to produce chips by 2031 that match the performance of advanced 1.4-nanometre technology – all without relying on Western chipmaking tools that are subject to China export bans under US export restrictions. For decades, the global semiconductor industry followed a simple rule: make chips faster by shrinking transistors to pack more onto a silicon wafer. However, after Washington blocked China from buying the advanced lithography machines needed to produce leading-edge chips, Huawei was forced to change its approach. Instead of making the hardware smaller, Huawei’s new strategy – dubbed the Tau (τ) Scaling Law – focuses on speed. It aims to accelerate how fast electrical signals travel across a chip by reducing resistance and tightening the internal wiring.

**Companies:** Huawei Technologies
**Countries:** China, United States

[Read the full story on South China Morning Post](https://www.scmp.com/tech/tech-war/article/3355066/peking-university-unveils-3d-design-tool-power-huaweis-chip-ambitions)

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