# 該項目估計約33億美元，將在奧里薩邦布巴內斯瓦爾-庫爾達地區建立先進封裝玻璃核心基板製造設施。

*semiconductor · news · 2026-05-29 · Times of India*

## Key points

- 英特爾與3DGS將在奧里薩設立一座33億美元的玻璃核心基板工廠。
- 該設施是印度首個專注於半導體先進封裝玻璃核心基板的工廠。
- 該項目初期將創造超過1,800個高技能直接就業機會。
- 基板製造曾是印度產業鏈中的缺失環節，現將在國內建立。
- 該諒解備忘錄標誌著印度迄今最大規模的高科技製造投資之一。

The project, estimated at around $3.3 billion, will set up an advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region of Odisha Bengaluru: India’s semiconductor ambitions received a major boost after the Odisha govt signed an MoU with Intel and US-based 3DGS on Friday to bring advanced substrate manufacturing technology to the country. The Centre described the initiative as one of India’s largest high-technology manufacturing investments. The project, estimated at around $3.3 billion, will set up an advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region of Odisha. The proposed unit will focus on advanced packaging glass-core substrates, high-density interconnect substrates and related semiconductor technologies. Union electronics and IT minister Ashwini Vaishnaw, Odisha chief minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan and other dignitaries witnessed the signing of the agreement. Vaishnaw said investments by global semiconductor firms reflect growing confidence in India’s semiconductor push and the govt’s policy efforts in the sector. “Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance the semiconductor ecosystem in India,” the Union minister wrote on X. The project will be implemented in phases over five to six years and is expected to create more than 1,800 direct high-skilled jobs, besides generating indirect employment opportunities across manufacturing and technology ecosystems. The Centre said the initiative builds on efforts under the India Semiconductor Mission (ISM) to strengthen domestic manufacturing, semiconductor design capabilities and supply-chain resilience. Substrates are a critical component in semiconductor packaging, helping connect and support semiconductor chips used in electronic devices. Industry executives have often described substrate manufacturing as one of the missing links in India’s semiconductor value chain. The latest development adds to India’s broader semiconductor ecosystem push, which has already seen companies such as Applied Materials, Lam Research and Tokyo Electron announce investments or partnerships in the country. The govt has also been pushing semiconductor packaging and assembly capabilities alongside chip fabrication projects. Earlier this month, the govt approved two semiconductor-related projects under the ISM. These include a gallium nitride-based mini/micro LED display facility and a semiconductor packaging unit in Gujarat involving investments of around Rs 3,936 crore. The Odisha project is expected to support export-oriented manufacturing and position the state as an emerging semiconductor and digital infrastructure hub. End of Article

**Companies:** Intel, 3DGS
**Countries:** India, United States

[Read the full story on Times of India](https://timesofindia.indiatimes.com/city/bengaluru/odisha-inks-3-3-bn-chip-substrate-manufacturing-mou-with-intel-3dgs/articleshow/131393045.cms)

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