# 印度週五簽署了迄今為止最大規模的高科技製造協議之一。

*semiconductor · news · 2026-05-29 · NDTV Profit*

## Key points

- 英特爾與3DGS將在印度奧里薩建設一座33億美元的半導體基板工廠。
- 新設施將生產先進封裝玻璃基板及高密度互連基板。
- 英特爾將提供技術專長及製程經驗，支持此高端製造項目。
- 此項目標誌著印度首次進入先進基板技術領域，而非僅限於組裝。

India on Friday signed one of its largest high-technology manufacturing agreements yet, with Intel and US-based 3D Glass Solutions Inc. (3DGS) partnering with the Odisha government for a $3.3 billion semiconductor substrate manufacturing project. The agreement, signed in the presence of Electronics and IT Minister Ashwini Vaishnaw and Odisha Chief Minister Mohan Charan Majhi, will see an advanced semiconductor packaging and glass-core substrate manufacturing facility come up in the Bhubaneswar-Khurda region over the next five to six years. ALSO READ | CarryMen Rejects 'Modern Slavery' Criticism, Says Workers Are Full-Time Employees The proposed facility will manufacture advanced packaging glass-core semiconductor substrates and high-density interconnect substrates, which are critical components used in advanced chip packaging technologies. Intel will provide technology know-how and process expertise for the project, marking a significant deepening of India's semiconductor manufacturing ambitions beyond assembly and testing into higher-end substrate technologies. The investment is among the largest in India's high-tech manufacturing sector and builds on the Centre's broader push under the India Semiconductor Mission to create a full semiconductor ecosystem in the country. Speaking at the signing event, Vaishnaw said the entry of global semiconductor ecosystem firms into India reflects growing industry confidence in the country's semiconductor policy framework. The project is also expected to strengthen India's ambitions in export-oriented semiconductor manufacturing and position Odisha as an emerging electronics and semiconductor hub. ALSO READ | Jio Backs Airtel On 5G Network Slicing, Says Service Does Not Breach Net Neutrality Norms The move comes as India aggressively pushes to attract global semiconductor investments amid ongoing global efforts to diversify chip supply chains beyond traditional manufacturing centres.

**Companies:** Intel, 3D Glass Solutions Inc.
**Countries:** India, United States

[Read the full story on NDTV Profit](https://www.ndtvprofit.com/economy/india-signs-one-of-its-biggest-hi-tech-manufacturing-bets-with-3-3-billion-odisha-semiconductor-project-11564474)

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