# 台積電高層表示亞利桑那設施已開始動工。

*semiconductor · news · 2026-04-22 · Reuters*

## Key points

- 台積電已開始擴建亞利桑那設施，增設先進封裝能力。
- 台積電計劃於2029年前在亞利桑那新增CoWoS與3D-IC封裝技術。
- 目前台積電亞利桑那生產的晶片會送回台灣進行封裝流程。
- 台積電與Amkor持續洽談，以提升美國客戶的封裝技術選項。

Sign up here. At a conference in Santa Clara, California, on ​Wednesday, TSMC executives said construction has begun. "We are aggressively expanding our own capability within ​the Arizona facility," Kevin Zhang, deputy co-chief operations officer and senior vice president, said on Tuesday ahead of the conference. "We are going to build a CoWoS capability and 3D-IC capability there before ​2029, so that's still our goal," Zhang said, referring to two of TSMC's ​packaging technologies that are in high demand. Companies such as Apple and Nvidia already source chips from ‌TSMC's Arizona ⁠factory, but many of those chips must go back to Taiwan for packaging. Zhang said Amkor and TSMC's technology discussions remain ongoing. "We are ​partnering with ⁠them to see what kind of technology capability they can offer to our customers in order to accelerate some of the products to be manufactured in the U.S.," Zhang ⁠said. "There are ​still some moving parts. I would say we ​are definitely looking at all possibilities to have a very diverse manufacturing footprint." Reporting by Stephen Nellis and Max ​Cherney in Santa Clara, California and Wee-Yee Lee in Taipei; Editing by Rod Nickel Our Standards: The Thomson Reuters Trust Principles., opens new tab Max A. Cherney is a correspondent for Reuters based in San Francisco, where he reports on the semiconductor industry and artificial intelligence. He joined Reuters in 2023 and has previously worked for Barron’s magazine and its sister publication, MarketWatch. Cherney graduated from Trent University with a degree in history.

**Companies:** TSMC, Apple, Nvidia, Amkor
**Countries:** United States, Taiwan

[Read the full story on Reuters](https://www.reuters.com/world/asia-pacific/tsmc-plans-open-chip-packaging-plant-arizona-by-2029-executive-says-2026-04-22/)

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