# 晶片製造商英特爾公司與奧里薩邦政府及3DGS簽署協議，將半導體基板製造技術引入印度。

*semiconductor · news · 2026-05-29 · The Hindu Business Line*

## Key points

- 英特爾、奧里薩邦政府及3DGS簽署諒解備忘錄，將基板製造技術帶入印度。
- 該項目涉及33億美元投資，為英特爾在印度的首個直接製造項目。
- 位於布巴內斯瓦-庫爾達的設施將專注於先進玻璃核心及高密度互連基板。
- 項目將在五至六年內實施，創造超過1,800個直接高技能工作機會。

Chip maker Intel Corporations has signed a pact with the Odisha government and 3DGS to bring semiconductor substrate manufacturing technology to India, an official said on Friday. Union Minister of Electronics and IT, Ashwini Vaishnaw along with Chief Minister of Odisha, Mohan Charan Majhi, Intel CEO Lip-Bu Tan, and other dignitaries, witnessed the signing of an MoU to bring substrate manufacturing technology to India, the statement said. "Congratulations to the Govt of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India. This will further advance the semiconductor ecosystem in India," Vaishnaw said. A semiconductor substrate is the layer of chip on which circuits are built. The project, with an estimated investment of about USD 3.3 billion, represents one of the largest high-technology manufacturing investments in the country and first project with the engagement of computer chip major Intel. "The proposed project would be implemented in phases over a period of five-six years. It is expected to generate more than 1,800 direct high-skilled employment opportunities while creating significant indirect employment across the broader manufacturing and technology ecosystem," the statement said. The facility is proposed in the Bhubaneswar-Khurda region. "The facility will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise. It is expected to contribute to capability development, ecosystem growth and export-oriented manufacturing in India," the statement said. Vaishnaw during the event said the entry of firms like Applied Materials Inc, Lam Research, Tokyo Electron Ltd, Merck Electronics, and signing of the MoU between Tata Electronics and Dutch multinational ASML -- is a recognition of the government's efforts in the semiconductor sector and the trust the industry places in India. India is now gearing up for the launch of India Semicon Mission 2.0, which is expected to incentivise the entire chip manufacturing ecosystem players, including gases and chemicals. Published on May 29, 2026

**Companies:** Intel Corporation, 3DGS
**Countries:** India

[Read the full story on The Hindu Business Line](https://www.thehindubusinessline.com/info-tech/intel-partners-odisha-govt-3dgs-for-semiconductor-substrate-manufacturing-in-india/article71037975.ece)

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