# Lam Research 在奧地利薩爾茨堡成立新研究實驗室，專注於先進晶片封裝技術，目標提升晶片密度並降低生產成本。

*semiconductor · news · 2026-05-20 · The Economic Times*

## Key points

- Lam Research 新設立的薩爾茨堡實驗室專注於半導體面板級封裝技術。
- 面板級封裝採用方形面板取代圓形晶圓，減少材料浪費與成本。
- 薩爾茨堡設施是 Lam 首個專注於半導體材料濕製程的面板級實驗室。
- 該實驗室利用了 Lam Research 於 2022 年收購的 Semsysco GmbH 專業技術。

**Companies:** Lam Research, Taiwan Semiconductor Manufacturing Co, Samsung Electronics, ASML, KLA Corp, Semsysco GmbH
**Countries:** Austria, United States, Taiwan

[Read the full story on The Economic Times](https://economictimes.indiatimes.com/tech/artificial-intelligence/lam-research-opens-austria-lab-to-advance-chip-packaging-cut-costs/articleshow/131227484.cms)

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