# 三星已開始出貨其最新高頻寬記憶體（HBM）晶片樣品。

*semiconductor · news · 2026-05-28 · Reuters*

## Key points

- 三星已開始出貨業界首款 12 層 HBM4E 晶片樣品。
- 新款 HBM4E 晶片速度比前一代 HBM4 晶片快超過 20%。
- 三星的 HBM4E 晶片採用第六代 10 奈米級 DRAM 與 4 奈米製程邏輯基底晶片。
- 此次 HBM4E 樣品出貨距三星首次出貨 HBM4 晶片僅三個月。

SEOUL, May 29 (Reuters) - Samsung Electronics (005930.KS), opens new tab said ​on Friday it has started shipping samples ‌of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking what it said was ​the industry's first shipment of such products. The South ​Korean tech company said the new chip ⁠represents a more than 20% increase ​in speed performance over its previous-generation HBM4 ​products. Sign up here. Samsung said the chip uses its latest 1c DRAM process technology, or sixth-generation 10-nanometer-class DRAM, alongside Samsung's 4-nanometer ​foundry logic base die. The chipmaker said ​in April that it planned to ship the first ‌sample ⁠of HBM4E chips in the second quarter. The move comes just three months after Samsung began shipping its HBM4, opens new tab chips to customers in ​February, underscoring ​Samsung's efforts ⁠to strengthen its position in the next-generation AI memory market ​by proactively supplying samples of its ​latest ⁠products. Samsung's customers include major AI players such as AMD (AMD.O), opens new tab, Nvidia (NVDA.O), opens new tab and Google (GOOGL.O), opens new tab, among others, ⁠as ​demand surges for advanced ​memory chips used in AI servers and processors. Reporting by Heekyong ​Yang and Jack Kim; Editing by Ed Davies

**Companies:** Samsung Electronics, AMD, Nvidia, Google
**Countries:** South Korea, United States

[Read the full story on Reuters](https://www.reuters.com/world/asia-pacific/samsung-electronics-ships-hbm4e-chip-samples-global-customers-2026-05-28/)

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