# Most of the chipmaking step, also known as advanced packaging, happens in Asia.

*semiconductor · news · 2026-04-08 · Firstpost*

## Key points

- Nvidia has reserved most of TSMC's advanced packaging capacity, limiting availability for competitors.
- Elon Musk has chosen Intel to package custom chips for SpaceX, xAI, and Tesla in Texas.
- TSMC currently sends all chips, even those made in Arizona, back to Taiwan for packaging.
- 3D packaging and hybrid bonding are emerging as the next major advances in chip assembly.

**Companies:** Nvidia, TSMC, Intel, ASE, Amkor
**Countries:** Taiwan, United States

[Read the full story on Firstpost](https://www.firstpost.com/tech/ais-next-challenge-why-even-us-made-chips-must-undergo-final-processing-in-taiwan-13998128.html)

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