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Taiwan Semiconductor Manufacturing Co plans to open a chip packaging plant in Arizona.
TSMC will open a chip packaging plant in Arizona before 2029, construction has begun.
KEY POINTS
- TSMC's new Arizona facility will include CoWoS and 3D-IC advanced packaging capabilities.
- Currently, chips made in Arizona for Apple and Nvidia are returned to Taiwan for packaging.
- Amkor Technology aims to start advanced chip packaging in Arizona by early 2028, earlier than TSMC.
- TSMC and Amkor are still negotiating specific technology capabilities to offer customers in the U.S.
COMPANIES
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