# Taiwan Semiconductor Manufacturing Co plans to open a chip packaging plant in Arizona.

*semiconductor · news · 2026-04-22 · MarketScreener*

## Key points

- TSMC will open a chip packaging plant in Arizona before 2029, construction has begun.
- TSMC's new Arizona facility will include CoWoS and 3D-IC advanced packaging capabilities.
- Currently, chips made in Arizona for Apple and Nvidia are returned to Taiwan for packaging.
- Amkor Technology aims to start advanced chip packaging in Arizona by early 2028, earlier than TSMC.
- TSMC and Amkor are still negotiating specific technology capabilities to offer customers in the U.S.

**Companies:** Taiwan Semiconductor Manufacturing Co, Apple, Nvidia, Amkor Technology
**Countries:** Taiwan, United States

[Read the full story on MarketScreener](https://www.marketscreener.com/news/tsmc-plans-to-open-chip-packaging-plant-in-arizona-by-2029-executive-says-ce7f59d8d08af22c)

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