# The ambitious project, estimated at around USD 3.3 billion, stands as one of the most significant high-tech manufacturing investments in India.

*semiconductor · news · 2026-05-29 · Devdiscourse*

## Key points

- Odisha signed an MoU with Intel and 3DGS Inc. to build a packaging glass core substrate plant.
- The facility in Bhubaneswar is estimated to cost about USD 3.3 billion.
- Intel will provide essential technology expertise for the new advanced manufacturing facility.
- The project is expected to create over 1,800 specialized jobs in its first phase.

India's drive to enhance its semiconductor production capacity received a substantial boost as Odisha inked an agreement with Intel Corporation and 3DGS Inc. of the USA. This landmark initiative involves establishing an advanced packaging glass core substrate production facility in Bhubaneswar. The ambitious project, estimated at around USD 3.3 billion, stands as one of the most significant high-tech manufacturing investments in India. Union Minister of Electronics and IT Ashwini Vaishnaw emphasized the significance of this undertaking. 'This MoU will propel India's semiconductor ecosystem forward,' Vaishnaw stated in a recent social media update. Located in Info Valley, the facility aims to generate over 1,800 specialized jobs and countless indirect opportunities in the wider tech and manufacturing sectors. The project will unfold in multiple phases over five to six years with crucial tech expertise and knowledge from Intel. (With inputs from agencies.)

**Companies:** Intel Corporation, 3DGS Inc.
**Countries:** India, USA

[Read the full story on Devdiscourse](https://www.devdiscourse.com/article/business/3925987-odisha-partners-with-intel-and-3dgs-to-boost-semiconductor-manufacturing)

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