# iHBM solution embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.

*semiconductor · news · 2026-05-26 · The Manila Times*

## Key points

- SK hynix's new iHBM embeds integrated cooling elements (ICEs) directly in the HBM package.
- This iHBM approach reduces thermal resistance by 30% versus conventional HBM cooling methods.
- ICEs are positioned in the D2D PHY area for greater heat dissipation at the point of highest heat concentration.
- Mass-production is enabled by SK hynix's market-proven MR-MUF technology, allowing broad compatibility with existing SiP designs.
- iHBM will first be deployed in next-generation products such as HBM5 for AI data centers and HPCs.

**Companies:** SK hynix
**Countries:** South Korea

[Read the full story on The Manila Times](https://www.manilatimes.net/2026/05/26/tmt-newswire/pr-newswire/sk-hynix-unveils-ihbm-thermal-solution-to-boost-ai-performance/2351242)

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