# AMD has made over $10b in investments to its strategic partners across Taiwan as it's inches away from deploying 6th Gen EPYC & MI450X inside its Helios AI racks.

*semiconductor · news · 2026-05-21 · Wccftech*

## Key points

- AMD invested over $10 billion in the Taiwan ecosystem to expand advanced packaging for AI infrastructure.
- The Helios AI rack will debut with 6th Gen EPYC 'Venice' CPUs and Instinct MI450X GPUs in 2H 2026.
- AMD qualified the industry's first 2.5D panel-based EFB interconnect with PTI, enabling scalable high-bandwidth AI systems.
- The new EFB-based 2.5D packaging raises interconnect bandwidth and efficiency for the Venice CPU generation.

**Companies:** AMD, Sanmina, Wiwynn, Wistron, Inventec, SPIL, PTI, Unimicron, AIC, Nan Ya PCB, Kinsus
**Countries:** Taiwan

[Read the full story on Wccftech](https://wccftech.com/amd-injects-over-10b-in-fresh-investments-to-taiwanese-firms-as-it-preps-its-6th-gen-epyc-mi450x-for-multi-gw-ai-deployments/)

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