# Almost all of the chipmaking step, known as advanced packaging, happens in Asia.

*semiconductor · news · 2026-04-08 · CNBC*

## Key points

- TSMC currently sends 100% of its chips to Taiwan for advanced packaging, even those made in Arizona.
- Nvidia has reserved most of TSMC's latest CoWoS-L packaging capacity, creating a supply bottleneck.
- Intel's advanced packaging customers include Amazon, Cisco, and now Elon Musk's SpaceX, xAI, and Tesla.
- TSMC and Intel are developing 3D packaging methods, with TSMC's SoIC products expected in a few years.
- Hybrid bonding, replacing bumps with copper pads, is emerging to improve chip stacking and performance.

**Companies:** Taiwan Semiconductor Manufacturing Co., Nvidia, Intel, Amazon, Cisco
**Countries:** Taiwan, United States, Vietnam, Malaysia, China

[Read the full story on CNBC](https://www.cnbc.com/2026/04/08/tsmc-nvidia-advanced-packaging-intel.html)

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