semiconductor / news / / Wccftech
TSMC is gearing up to 'double down' on its efforts with advanced packaging supply.
TSMC plans to convert older 8-inch wafer fabs in Taiwan for advanced packaging supply.
KEY POINTS
- Seven TSMC fabs in Taiwan will be equipped with advanced packaging technologies like CoWoS, WMCM, and SoIC.
- TSMC aims to increase advanced packaging wafer output from 1.3 million to 2 million by 2027.
- TSMC's first advanced packaging facilities in Arizona are expected to begin mass production by 2030.
COMPANIES
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