# TSMC is gearing up to 'double down' on its efforts with advanced packaging supply.

*semiconductor · news · 2026-04-13 · Wccftech*

## Key points

- TSMC plans to convert older 8-inch wafer fabs in Taiwan for advanced packaging supply.
- Seven TSMC fabs in Taiwan will be equipped with advanced packaging technologies like CoWoS, WMCM, and SoIC.
- TSMC aims to increase advanced packaging wafer output from 1.3 million to 2 million by 2027.
- TSMC's first advanced packaging facilities in Arizona are expected to begin mass production by 2030.

**Companies:** TSMC
**Countries:** Taiwan, United States

[Read the full story on Wccftech](https://wccftech.com/tsmc-is-now-pushing-to-solve-one-of-the-biggest-constraints-for-the-ai-industry/)

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