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Co-Packaged Optics (CPO) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals.
NVIDIA's Feynman GPUs will debut Co-Packaged Optics, accelerating their adoption to 2028.
KEY POINTS
- Originally, Co-Packaged Optics were scheduled for commercialization in 2033, now moved forward five years.
- Feynman GPUs will use 3D Die Stacking and Intel's advanced EMIB packaging technology.
- NVIDIA's Feynman GPUs will feature custom HBM memory, diverging from standard HBM5 solutions.
- Feynman GPUs will introduce a new Data Center CPU architecture called Rosa, replacing Vera.
COMPANIES
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