# Co-Packaged Optics (CPO) is the next-generation solution that reduces reliance on copper and harnesses light to transfer signals.

*semiconductor · news · 2026-05-03 · Wccftech*

## Key points

- NVIDIA's Feynman GPUs will debut Co-Packaged Optics, accelerating their adoption to 2028.
- Originally, Co-Packaged Optics were scheduled for commercialization in 2033, now moved forward five years.
- Feynman GPUs will use 3D Die Stacking and Intel's advanced EMIB packaging technology.
- NVIDIA's Feynman GPUs will feature custom HBM memory, diverging from standard HBM5 solutions.
- Feynman GPUs will introduce a new Data Center CPU architecture called Rosa, replacing Vera.

**Companies:** NVIDIA, Meta, Microsoft, AMD, Broadcom, OpenAI
**Countries:** United States

[Read the full story on Wccftech](https://wccftech.com/nvidia-fast-forwarded-co-packaged-optics-five-years-ahead-arriving-with-feynman-gpus/)

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