# Intel has been signaling that its advanced packaging business is having a growth spurt.

*semiconductor · news · 2026-04-07 · Ars Technica*

## Key points

- Intel's Fab 9 in New Mexico was restarted in 2024 after being dormant since 2007.
- Intel's advanced packaging business expects revenue to exceed $1 billion, up from earlier projections.
- Intel is in advanced packaging talks with Google and Amazon, both of whom design custom chips.
- Intel's new EMIB-T packaging technology will roll out in fabs this year, promising better efficiency.
- Intel now allows customers to use its packaging services for any part of the chipmaking process.

**Companies:** Intel, Taiwan Semiconductor Manufacturing Corporation, Google, Amazon
**Countries:** United States, Malaysia

[Read the full story on Ars Technica](https://arstechnica.com/gadgets/2026/04/intel-is-going-all-in-on-advanced-chip-packaging/)

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