semiconductor / news / / The Star
U.S. chipmaker Intel and 3DGS Inc. USA will invest $3.3 billion to set up a substrate manufacturing plant.
Intel and 3DGS Inc. USA will jointly invest $3.3 billion in Odisha, India.
KEY POINTS
- The Odisha plant will focus on advanced packaging glass core substrates and high-density interconnect substrates.
- The facility is projected to generate over 1,800 direct high-skilled jobs in the region.
- The plant will be built in the Bhubaneswar-Khurda region over five to six years.
COMPANIES
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