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semiconductor / news / / The Star

U.S. chipmaker Intel and 3DGS Inc. USA will invest $3.3 billion to set up a substrate manufacturing plant.

Intel and 3DGS Inc. USA will jointly invest $3.3 billion in Odisha, India.

KEY POINTS
NEW DELHI, ⁠May 29 (Reuters) - U.S. chipmaker Intel ⁠and 3DGS Inc. USA will invest ‌about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state ​of Odisha, the Indian ⁠government said on ⁠Friday. Here are some details: • The project ⁠is ‌expected to create more than 1,800 direct high-skilled jobs. • ⁠Substrates are the bedrock material on ​which ‌elements of a semiconductor device are ⁠attached. • ​New Delhi has pledged billions of dollars in subsidies to attract semiconductor ⁠plants and related manufacturing ​as a part of Prime Minister Narendra Modi's wider push to build ⁠more products locally. • The plant, planned to be set up in the Bhubaneswar-Khurda region over a period ​of five to six ⁠years, will focus on advanced packaging ​glass core substrates, ‌high-density interconnect substrates and ​associated semiconductor technologies. (Reporting by Hritam Mukherjee; Editing by Eileen Soreng)
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