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Taiwan Semiconductor Manufacturing Co plans to open chip packaging plant in Arizona by 2029.
TSMC plans to open a chip packaging plant in Arizona by 2029, executives confirmed.
KEY POINTS
- Construction has already started on the Arizona advanced packaging facility, according to TSMC.
- TSMC will build CoWoS and 3D-IC packaging capabilities in Arizona for AI chip demand.
- Amkor aims to open a competing Arizona packaging plant with Apple and Nvidia by early 2028.
- TSMC and Amkor are actively discussing joint advanced packaging technologies for U.S. manufacturing.
COMPANIES
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