# Taiwan Semiconductor Manufacturing Co plans to open chip packaging plant in Arizona by 2029.

*semiconductor · news · 2026-04-22 · The Star*

## Key points

- TSMC plans to open a chip packaging plant in Arizona by 2029, executives confirmed.
- Construction has already started on the Arizona advanced packaging facility, according to TSMC.
- TSMC will build CoWoS and 3D-IC packaging capabilities in Arizona for AI chip demand.
- Amkor aims to open a competing Arizona packaging plant with Apple and Nvidia by early 2028.
- TSMC and Amkor are actively discussing joint advanced packaging technologies for U.S. manufacturing.

**Companies:** Taiwan Semiconductor Manufacturing Co, Apple, Nvidia, Amkor Technology
**Countries:** Taiwan, United States

[Read the full story on The Star](https://www.thestar.com.my/tech/tech-news/2026/04/23/tsmc-plans-to-open-chip-packaging-plant-in-arizona-by-2029-executive-says-)

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