semiconductor / news / / Firstpost
Huawei Technologies unveiled a new chip development approach that it said would help China advance its semiconductor industry.
Huawei unveiled its 'Logic Folding' engineering method for Kirin chips, debuting later this year.
KEY POINTS
- Huawei claims Logic Folding could reach 1.4-nanometre class capabilities by 2031.
- Huawei designed and mass-produced 381 chips using its 'Tau Scaling Law' framework over six years.
- Huawei asserts chip advances can no longer rely solely on Moore's Law due to atomic-scale transistors.
COMPANIES
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