# Huawei Technologies unveiled a new chip development approach that it said would help China advance its semiconductor industry.

*semiconductor · news · 2026-05-25 · Firstpost*

## Key points

- Huawei unveiled its 'Logic Folding' engineering method for Kirin chips, debuting later this year.
- Huawei claims Logic Folding could reach 1.4-nanometre class capabilities by 2031.
- Huawei designed and mass-produced 381 chips using its 'Tau Scaling Law' framework over six years.
- Huawei asserts chip advances can no longer rely solely on Moore's Law due to atomic-scale transistors.

**Companies:** Huawei Technologies
**Countries:** China

[Read the full story on Firstpost](https://www.firstpost.com/tech/huawei-unveils-new-chip-design-strategy-amid-intensifying-global-semiconductor-competition-14015088.html)

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