# Intel and 3DGS join forces to introduce semiconductor substrate manufacturing technology to India.

*semiconductor · news · 2026-05-29 · Devdiscourse*

## Key points

- Intel, Odisha government, and 3DGS will introduce semiconductor substrate manufacturing to India.
- The collaboration involves a planned investment of approximately USD 3.3 billion.
- The Bhubaneswar-Khurda region has been chosen as the project location for advanced packaging innovation.
- Over 1,800 direct high-skilled jobs are expected to be created through this initiative.

Intel Corporation has joined forces with the Odisha government and 3DGS to introduce semiconductor substrate manufacturing technology to India. This collaboration highlights a substantial step towards strengthening the nation's semiconductor capabilities. The memorandum of understanding was signed with participation from electronics and IT minister Ashwini Vaishnaw and Odisha's chief minister, Mohan Charan Majhi. The agreement signals a significant investment in India's high-tech sector, with an estimated budget of USD 3.3 billion. The initiative aims to create over 1,800 direct high-skilled jobs and substantial indirect employment. Set in the Bhubaneswar-Khurda region, the project will ultimately enhance India's technological landscape, focusing on innovations in advanced packaging and high-density interconnect substrates. Apart from operational progress, the agreement marks a milestone with India's India Semicon Mission 2.0, reflecting the global industry's trust in India. (With inputs from agencies.)

**Companies:** Intel Corporation
**Countries:** India

[Read the full story on Devdiscourse](https://www.devdiscourse.com/article/technology/3926060-intel-collaborates-with-odisha-for-advanced-substrate-manufacturing-in-india)

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