semiconductor / news / / Wccftech
Intel's advanced packaging business has been booming since the start of the year.
Intel has secured 'billions of dollars' in customer commitments for advanced packaging this year.
KEY POINTS
- Google and Amazon are reportedly in talks to use Intel's EMIB packaging for their custom ASICs.
- TSMC's advanced packaging capacity is severely constrained, making Intel the main alternative for hyperscalers.
- Intel's EMIB technology is now seen as a technological rival to TSMC's CoWoS for AI architectures.
- Customer commitments for Intel's advanced packaging are officially set to begin in H2 2026.
COMPANIES
Summarized by Newsio from Wccftech. How we summarize →