# Intel's advanced packaging business has been booming since the start of the year.

*semiconductor · news · 2026-04-06 · Wccftech*

## Key points

- Intel has secured 'billions of dollars' in customer commitments for advanced packaging this year.
- Google and Amazon are reportedly in talks to use Intel's EMIB packaging for their custom ASICs.
- TSMC's advanced packaging capacity is severely constrained, making Intel the main alternative for hyperscalers.
- Intel's EMIB technology is now seen as a technological rival to TSMC's CoWoS for AI architectures.
- Customer commitments for Intel's advanced packaging are officially set to begin in H2 2026.

**Companies:** Intel, Google, Amazon
**Countries:** United States, Taiwan

[Read the full story on Wccftech](https://wccftech.com/intels-advanced-packaging-is-getting-the-attention-it-needs-from-ai-customers/)

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