semiconductor / news / / Wccftech
Apple and Intel have now reached a preliminary agreement.
Apple has signed a preliminary chip-making agreement with Intel, ending years without commercial ties.
KEY POINTS
- Some upcoming Apple devices will have silicon fabricated by Intel, not just TSMC.
- Apple may use Intel's 18A-P process for low-end M-series and non-Pro iPhone chips from 2027-2028.
- Intel's 18A-P process will support Foveros Direct 3D hybrid bonding for advanced chip stacking.
- Apple is actively seeking alternatives to TSMC as supply chain optionality becomes a priority.
COMPANIES
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