# Apple and Intel have now reached a preliminary agreement.

*semiconductor · news · 2026-05-08 · Wccftech*

## Key points

- Apple has signed a preliminary chip-making agreement with Intel, ending years without commercial ties.
- Some upcoming Apple devices will have silicon fabricated by Intel, not just TSMC.
- Apple may use Intel's 18A-P process for low-end M-series and non-Pro iPhone chips from 2027-2028.
- Intel's 18A-P process will support Foveros Direct 3D hybrid bonding for advanced chip stacking.
- Apple is actively seeking alternatives to TSMC as supply chain optionality becomes a priority.

**Companies:** Apple, Intel, Samsung
**Countries:** United States

[Read the full story on Wccftech](https://wccftech.com/apple-formally-returns-to-intels-fabs-after-burning-the-bridge-in-2023-signaling-a-major-tsmc-hedge/)

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