semiconductor / news / / PhoneArena
U.S. sanctions prevent Huawei from having its own cutting-edge designs turned into powerful chips.
Huawei will use Tau Scaling Law and LogicFolding to increase chip density without EUV lithography.
KEY POINTS
- The upcoming Mate 90 flagship will feature a Kirin processor using Tau Scaling and LogicFolding stacking.
- The new Kirin chip will boost transistor density by 53.5% to 238 million per square millimeter.
- Performance, core energy efficiency, and peak frequency will improve by 41% and 12.7% respectively.
- Huawei aims to mass-produce Tau Scaling chips equivalent to the 1.4nm node by 2031.
COMPANIES
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