# Baidu Inc.’s chip unit Kunlunxin is planning an initial public offering.

*semiconductor · news · 2026-05-08 · Bloomberg*

## Key points

- Kunlunxin, Baidu's chip unit, is planning an IPO on Shanghai's STAR Board.
- Kunlunxin is working with China International Capital Corp. for the Shanghai IPO process.
- Kunlunxin had previously confidentially filed for an IPO in Hong Kong earlier this year.
- This dual listing strategy targets growing investor interest in China's semiconductor industry.

**Companies:** Baidu Inc., Kunlunxin
**Countries:** China

[Read the full story on Bloomberg](https://www.bloomberg.com/news/articles/2026-05-08/baidu-s-ai-chip-unit-plans-dual-ipo-in-shanghai-and-hong-kong)

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