semiconductor / news / / NDTV Profit
India on Friday signed one of its largest high-technology manufacturing agreements yet.
Intel and 3DGS will build a $3.3 billion semiconductor substrate facility in Odisha, India.
KEY POINTS
- The new facility will produce advanced packaging glass-core and high-density interconnect substrates.
- Intel is providing technology know-how and process expertise for this high-end manufacturing project.
- This project marks one of India's first moves into advanced substrate technologies, not just assembly.
COMPANIES
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