semiconductor / news / / The Economic Times
US chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the Indian state of Odisha.
Intel and 3DGS Inc. USA will jointly invest $3.3 billion in Odisha for a new plant.
KEY POINTS
- The plant will focus on advanced packaging glass core substrates and high-density interconnect substrates.
- Over 1,800 high-skilled direct jobs are expected to be created by this new facility.
- The Bhubaneswar-Khurda region will host the plant, with a timeline of five to six years for setup.
COMPANIES
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