# Lisa Su’s Taiwan announcement covers advanced silicon, packaging and manufacturing partnerships for the company’'s rack-scale Helios platform.

*semiconductor · news · 2026-05-21 · TNW*

## Key points

- AMD announced a $10bn-plus investment in Taiwan's semiconductor ecosystem for next-generation AI infrastructure.
- The investment supports AMD's Helios platform, with customer deployments scheduled for the second half of 2026.
- AMD confirmed partnerships with ASE and SPIL for advanced 2.5D bridge interconnect packaging technology.
- This is AMD's largest disclosed single-country AI infrastructure commitment and secures a front-line foundry position for 2026-2027.

**Companies:** AMD, ASE, SPIL
**Countries:** Taiwan, United States

[Read the full story on TNW](https://thenextweb.com/news/amd-10bn-taiwan-ai-ecosystem-helios-ase-spil)

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