# TSMC executives say construction has begun on the Arizona facility.

*semiconductor · news · 2026-04-22 · Reuters*

## Key points

- TSMC has started construction to expand its Arizona facility with advanced packaging capabilities.
- TSMC plans to add CoWoS and 3D-IC packaging technology in Arizona before 2029.
- Currently, chips from TSMC Arizona are sent to Taiwan for packaging processes.
- TSMC and Amkor are in ongoing talks to enhance packaging technology options for U.S. customers.

Sign up here. At a conference in Santa Clara, California, on ​Wednesday, TSMC executives said construction has begun. "We are aggressively expanding our own capability within ​the Arizona facility," Kevin Zhang, deputy co-chief operations officer and senior vice president, said on Tuesday ahead of the conference. "We are going to build a CoWoS capability and 3D-IC capability there before ​2029, so that's still our goal," Zhang said, referring to two of TSMC's ​packaging technologies that are in high demand. Companies such as Apple and Nvidia already source chips from ‌TSMC's Arizona ⁠factory, but many of those chips must go back to Taiwan for packaging. Zhang said Amkor and TSMC's technology discussions remain ongoing. "We are ​partnering with ⁠them to see what kind of technology capability they can offer to our customers in order to accelerate some of the products to be manufactured in the U.S.," Zhang ⁠said. "There are ​still some moving parts. I would say we ​are definitely looking at all possibilities to have a very diverse manufacturing footprint." Reporting by Stephen Nellis and Max ​Cherney in Santa Clara, California and Wee-Yee Lee in Taipei; Editing by Rod Nickel Our Standards: The Thomson Reuters Trust Principles., opens new tab Max A. Cherney is a correspondent for Reuters based in San Francisco, where he reports on the semiconductor industry and artificial intelligence. He joined Reuters in 2023 and has previously worked for Barron’s magazine and its sister publication, MarketWatch. Cherney graduated from Trent University with a degree in history.

**Companies:** TSMC, Apple, Nvidia, Amkor
**Countries:** United States, Taiwan

[Read the full story on Reuters](https://www.reuters.com/world/asia-pacific/tsmc-plans-open-chip-packaging-plant-arizona-by-2029-executive-says-2026-04-22/)

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