semiconductor / news / / Wccftech
TSMC has presented its latest technology roadmap through 2029, bringing advanced processes such as A13 and A12 by 2029.
TSMC will not adopt ASML's advanced High-NA EUV lithography equipment through 2029 due to cost.
KEY POINTS
- TSMC's A13 (1.3nm) node, entering production in 2029, offers 6% area savings over A14.
- TSMC's A12 (1.2nm) process node introduces Super Power Rail technology for backside power, set for 2029.
- CoWoS packaging will scale to 14-reticle solutions by 2028, integrating 10 compute dies and 20 HBM stacks.
- TSMC-COUPE photonic engine will provide 2X power efficiency and 10X latency reduction, production begins 2026.
COMPANIES
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