semiconductor / news / / The Tribune
SK hynix's iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips.
SK hynix's iHBM integrates silicon-based cooling directly into HBM chips to address heat issues.
KEY POINTS
- The new design reduces thermal resistance by over 30% and maintains performance under heavy load.
- iHBM will first be used in HBM5 memory, set to launch around 2029 or 2030.
- The packaging is compatible with existing customer layouts, requiring no major architectural redesign.
- SK hynix's HBM customer demand for the next three years surpasses its production capacity.
COMPANIES
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