# SK hynix's iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips.

*semiconductor · news · 2026-05-26 · The Tribune*

## Key points

- SK hynix's iHBM integrates silicon-based cooling directly into HBM chips to address heat issues.
- The new design reduces thermal resistance by over 30% and maintains performance under heavy load.
- iHBM will first be used in HBM5 memory, set to launch around 2029 or 2030.
- The packaging is compatible with existing customer layouts, requiring no major architectural redesign.
- SK hynix's HBM customer demand for the next three years surpasses its production capacity.

**Companies:** SK hynix
**Countries:** South Korea

[Read the full story on The Tribune](https://www.tribuneindia.com/news/business/sk-hynixs-ihbm-to-cut-thermal-resistance-by-30-to-combat-ai-memory-overheating/)

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