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Intel Foundry Powers Next-Gen Data Centers & Networking With World's Thinnest GaN Chiplet.
Intel Foundry has produced the world's thinnest GaN chiplet at just 19μm thick.
KEY POINTS
- This chiplet integrates GaN transistors and silicon-based digital circuits on a single chip.
- The technology eliminates the need for separate companion chiplets, reducing energy loss and size.
- GaN chiplets can operate efficiently above 200 GHz, supporting next-generation 5G and 6G networks.
- Intel's GaN chiplets are manufactured on standard 300mm silicon wafers, easing industry adoption.
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